Technology Innovation and Talent Cultivation(技术创新与人才培养)
面向产业需求的21世纪微电子技术的发展
硅集成电路光刻技术的发展与挑战
超深亚微米集成电路中的互连问题
微电子芯片技术发展对材料的需求
微机电系统
学术论文
第一部分SOI/CMOS器件与电路研究
A HighPerformance SOI Drivein Gate Controlled Hybrid Transistor(一个高性能SOI退火推进型栅控混合晶体管)
Comprehensive Analysis of The Short Channel Effect in The SOI Gate Controlled Hybrid Transistor (SOI栅控混合晶体管短沟效应的全面分析)
The Behavior of NarrowWidth SOI MOSFET’s with MESA Isolation(采用MESA隔离的窄宽度SOI MOSFET器件的特性)
采用CoSi2 SALICIDE结构CMOS/SOI器件辐照特性的实验研究
Hot Carrier Induced Degradation in MesaIsolated nChannel SOI MOSFETs Operating in a BiMOS Mode(工作在Bi-MOS模式下MESA隔离的n沟SOI MOSFET的热载流子导致的退化)
全耗尽SOI MOSFET辐照导致的阈值电压漂移模型
一个适用于模拟电路的深亚微米 SOI MOSFET器件模型
适用于数模混合集成的SOI MOSFET的失真分析
一个解析的适用于短沟SOI MOSFET s 的高频噪声模型
A TwoDimensional PhysicallyBased Current Model for Deep Submicrometer SOI Dynamic ThresholdVoltage MOSFET(用于深亚微米SOI动态阈值电压MOSFET的一个基于物理机制的二维电流模型)292
A Novel Idea: Using DTMOS to Suppress FIBL Effect in MOSFET with Highk Gate Dielectrics(一个新的用DTMOS抑制MOSFET的FIBL效应的方法)
Distortion Behavior for SOI MOSFET(SOI MOSFET的失真行为)
Design Guideline of an UltraThin Body SOI MOSFET for LowPower andHighPerformance Applications(高速低功耗超薄体SOI MOSFET的设计方法)
第二部分 超深亚微米器件研究——模型,TCAD,HighK Effect of Grain Boundary on Minority Carrier Injection into Polysilicon Emitter(晶粒边界对少数载流子注入多晶硅发射极的影响)
The Influence of Tunneling Effect and Inversion Layer Quantization Effect on Threshold Voltage of Deep Submicron MOSFET(隧穿效应和反型层量子化效应对深亚微米MOSFET的影响)
Computer Simulation on Low Energy Ion Implantation Based on MolecularDynamics Methods(基于分子动力学方法的低能离子注入的计算机模拟)
3~6nm 超薄SiO2栅介质的特性
Threshold Voltage Model for MOSFETs with HighK Gate Dielectrics(高K栅介质MOSFETs的阈值电压模型)
Interfacial and Structural Characteristics of CeO2 Films on Silicon with a Nitrided Interface Formed by NitrogenIonBeam Bombardment(采用氮离子来轰击形成的硅上CeO2的氮化物界面层的表面和结构特征)
Influences of H+2 and He+ Coimplantation into Silicon on Electric Characteristics of MOSFETs(氢氦联合注入硅对MOSFET电性能的影响)
Atomistic Simulation of Defects Evolution in Silicon During Annealing After Low Energy SelfIon Implantation(原子模型模拟硅离子注入硅衬底的退火过程中的缺陷演化)
Highly Scaled CMOS Device Technologies with New Structures and New Materials(采用新结构和新材料高度等比例缩小CMOS器件技术)
第三部分 微机电系统(MEMS)研究
SiliconGlass Wafer Bonding with Silicon Hydrophilic Fusion Bonding Technology(采用硅亲水熔融键合技术实现硅/玻璃键合)
A Bulk Micromachined Vibratory Lateral Gyroscope Fabricated with Wafer Bonding and Deep Trench Etching(利用圆片键合和深刻蚀技术制造的体硅横向振动陀螺)
An Improved TMAH SiEtching Solution Without Attacking Exposed Aluminum(一种不腐蚀Al的TMAH硅腐蚀液)
A Small Equipment of Q study of Microgyroscope(陀螺品质因子小型测试系统)
An Experimental Study on HighTemperature Metallization for MicroHotplateBased Integrated Gas Sensors(基于微热板的集成化学传感器高温金属化实验研究)
硅基MEMS加工技术及其标准工艺研究
Fabrication of KeyholeFree UltraDeep HighAspectRatio Isolation Trench and Its Applications(无空洞超深高深宽比隔离槽制造技术及应用)
Simulation of The Bosch Process with a StringCell Hybrid Method(采用线单元混合模型进行BOSCH仿真)
Integrated BulkMicromachined Gyroscope Using Deep Trench Isolation Technology(采用深槽刻蚀技术的集成体硅陀螺)5
第四部分 RF与电路研究
Numerical Calculation of Electromigration Under Pulse Current with Joule Heating(考虑焦耳热的脉冲直流下电迁移数值计算)
Dependence of Electromigration Caused by Different Mechanisms on Current Densities in VLSI Interconnects(VLSI互连中不同机制下电迁移特性与电流密度的关系)
多晶硅发射极超高速集成电路工艺
Study on a LateralElectricalField Pixel Architecture for FLC Spatial Light Modulator with Continuously Tunable Grayscales(可连续调节灰度的FLC光谱调节器的横向电场像素结构研究)
以下为对购买帮助不大的评价