【现货速发】非晶态和纳米合金的化学镀：制备原理、微观结构和理论
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作者张邦维 著
出版社化学工业出版社
ISBN9787122291608
出版时间2017-03
装帧精装
开本16开
定价498元
货号25072068
上书时间2024-12-19
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前言
The electroless plating (EP) covered in this book is somewhat different from the original usage of the term by Brenner. Brenner’s use of the term electroless plating originally meant autocatalytic plating [1] . The term electroless plating, as used in this book, is not limited to the autocatalytic deposition but includes all chemical plating. So, the defi nition of electroless plating, as used in this book,involves immersing a substrate/workpiece into a bath solution, a metal/alloy or compound layer is then deposited on it via the transfer of electrons between reacting chemical species during the chemical reactions (redox reaction) without any applied current. It should be pointed out that displacement deposition is included in the electroless plating [2?C4] . Displacement deposition is also known as galvanic or immersion plating. A more noble metal, that is the redox potential of a metal ion in solution, because it is more positive always deposits on the surface of a less noble metal in the galvanic displacement deposition. The less noble metal acts as a reducing agent. The difference between electroless plating and galvanic displacement deposition is that a reducing agent is necessary in former case, but is not required in latter case. That is why galvanic displacement deposition is simpler and faster [5?C8] .There are a lot of advantages of EP compared to traditional electrolytic deposition, such as:No external electric source, including rectifi ers, batteries or anodes is needed so that the equipment needed for electroless plating is rather simple.Excellent uniformity and less porous deposits are produced, even on complex components. On the other hand, there exists the phenomenon of current density concentration at peaks and protrusions in the electrolytic plating process. So, the fi lms produced by electrolytic plating are not always uniform,there are nearly no deposits at protrusions or in the ecesses. In addition,the fi lms always have pinholes, which make the deposits susceptible to rust.The electroless deposition process is easy to use in volume production.Deposits can be produced directly on non-conductive materials such as ceramics and plastics and other so-called hard plating substrates.Deposits usually have unique properties, which have applications in many industries.Compared to the traditional electrolytic deposition process, there are also some drawbacks to electroless plating:The EP baths are usually rather more complex than electrolytic deposition baths, so they are more expensive than electrolytic deposition.Compared with the electrolytic plating process, EP has a limited life, and therefore the composition of consumption in the bath should be often added,especially during the process of the bulk production.Electroless processes result in a higher waste treatment burden than that of electrolytic processes, which causes more troubles of waste solution treatment.Since electroless plating was discovered by Brenner and Riddell in 1946,nearly seventy years have passed. EP is highly developed today, and is used in most parts of industry. Many basic subjects of EP, such as the improvement of bath solutions and new bath solutions, new alloy deposition, the extension of plating substrates, the mechanisms, especially the theory of electroless plating,nano electroless deposition, properties of in-depth study, and so forth have been studied and gratifying progress has been made. Considerable advances in such issues have been made in recent years, especially since the beginning of the new century. This can be corroborated from the fact that many papers were published in recent years. If you put “electroless plating” into the Elsevier data base, as of November 1, 2014, 10,565 papers can be found. The
导语摘要
本书全面阐述了非晶态和纳米合金化学镀的制备原理（镀槽与稳定性，镀速及影响因素）、微观结构、机理、形成和形成区理论以及微观理论。本书突出原创，集中阐述了铁基化学镀合金镀层与非晶合金镀层形成和形成区理论等作者具有自主知识产权的成果，以及纳米合金化学镀、镀速统一分析、表面形貌及分析、形成和微观理论等内容，反映了国际化学镀发展的*内容。作者以独特的视角讲述并分析了化学镀70 多年来的发展史。通过发现式写法，在阐述内容的同时，指出问题和发展方向，引导读者深入思考。本书可供材料、物理、化学等相关学科科研技术人员、研究生，对科研和工业关心的公职与公众人士阅读。
作者简介
张邦维，湖南大学应用物理系，教授、博导，在物理和材料科学领域从事教学和科研愈50年，他的研究集中于纳米和非晶态材料， EP合金镀层，合金热力学和理论，EAM理论与应用，其成果得到国内外学术界的广泛引用和承认。他曾获得过德国马普奖学金，并两次在德国IPP(等离子体物理所)合作研究工作，也曾两次在美国弗吉尼亚大学材料科学工程系合作研究。他和他的研究组在纳米材料工作过20多年，集中于纳米材料各种制备方法及其形成理论上。
目录
Preface xv
Part I
History of Electroless Plating
1. History–From the Discovery of Electroless Plating to the Present
1.1 Discovery of Electroless Plating 4
1.1.1 Early Works 4
1.1.2 Brenner and Riddell’s Work 6
1.2 Early Stage of Development (1940s–1959) 9
1.2.1 Research Works 9
1.2.2 Patents Issued 10
1.2.3 Preliminary Applications 12
1.3 Slow Growth of Period (1960–1979) 12
1.3.1 Improvement of the Plating Bath 13
1.3.2 Various Electroless Plating Metals 17
1.3.3 Electroless Plating Cu 20
1.3.4 Deposition Substrate 23
1.3.5 Application 26
1.4 Rapid Development of Period (1980–1999) 26
1.4.1 Studying the Nature of Electroless Plating 26
1.4.2 Studying the Properties of Electroless Plating Deposits 27
1.4.3 Large-Scale Application in Many Industries 31
1.4.4 Investigation of Ternary and Multicomponent Alloys and Composites 33
1.4.5 Electroless Plating Began and Developed Rapidly in China 34
1.4.6 Electroless Plating Fe–B Based Alloys Have Been Proposed and Developed 35
1.5 In-Depth Development and Nanoelectroless Plating Stage (2000–Present) 36
1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating 38
1.5.2 Rapid Development of Nanoelectroless Plating 38
1.6 Summary and Prospect 39
References 40
Part II
Technology of Electroless Plating-Plating Bath, Critical Parameters, Deposition Rate,and Stability of Plating Bath
2. Electroless Plating Baths of Metals, Binary Alloys,and Multicomponent Alloys
2.1 General Consideration for Electroless Plating Bath Solution 51
2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys 53
2.2.1 Pure Ni and Co Metals 53
2.2.2 Ni–P 53
2.2.3 Ni–B 53
2.3 Cobalt-Based Binary Alloys 57
2.3.1 Co–P 57
2.3.2 Co–B 57
2.4 Cu and Copper-Based Binary Alloys 58
2.5 Au 58
2.6 Ag 58
2.7 Pd and Palladium-Based Binary Alloys 59
2.8 Pt and Platinum-Based Binary Alloys 59
2.9 Ru, Rh, Os, and Cr–P Binary Alloys 59
2.10 Group B Metals (Zn, Cd, In, Sn, Pb, As, Sb, and Bi) and a Few Binary Alloys of these Metals 62
2.11 Electroless Plating of Ternary Alloys 67
2.11.1 Ni–Me–P Alloy Plating Baths 67
2.11.2 Co–Me–P Alloy Plating Baths 74
2.11.3 Ni–Me–B Alloy Plating Baths 74
2.11.4 Co–Me–B Alloy Plating Baths 74
2.11.5 Other Ternary Alloy Plating Baths 89
2.12 Electroless Plating of Quaternary Alloys 90
2.12.1 Ni-Based Quaternary Alloy Plating Baths 90
2.12.2 Co-Based Quaternary Alloy Plating Baths 90
2.13 Electroless Plating Quinary and Multialloys 90
2.14 Summary 90
References 100
3. Electroless Composite Plating
3.1 General Considerations about ECP 109
3.2 Bath Solutions of ECP 110
3.2.1 Bath for Binary Alloy-Based ECP 110
3.2.2 Bath for Ternary Alloy-Based ECP 113
3.2.3 Bath for ECP With Two Kinds of Particles 116
3.3 Summary 116
References 138
4. Nano Electroless Plating
4.1 Bulk Nano EP Materials 144
4.1.1 Nano ECP 144
4.1.2 EP Three-Dimensional Nanostructured Materials (3D NSMs) 163
4.2 2D Nano EP Materials 172
4.2.1 EP 2D Nano Films 173
4.2.2 EP 2D Nanoplates 181
4.2.3 EP 2D Nanodisks 182
4.2.4 EP 2D Nanoshells and Nanosheets 183
4.2.5 EP 2D Nanowalls 184
4.2.6 EP 2D Nano Circles and Rings 185
4.2.7 EP 2D Nanohoneycomb 187
4.2.8 EP 2D Nanoline, Nanofi n Pattern, and 2D Nano Grating 188
4.3 Linear (1D) Nano EP Materials 191
4.3.1 EP Nanotubes 191
4.3.2 EP Nanowires 214
4.3.3 EP Nanorods 240
4.3.4 EP Nanobelts 246
4.4 Zero-Dimensional Nano EP Materials 250
4.4.1 EP Nanoparticles 251
4.4.2 EP Nanoparticle Arrays 262
4.4.3 EP Nanoparticles Other Than Spherical Shape 264
4.4.4 EP Core-Shell Nanoparticles 268
4.5 Summary 278
References 279
5. Electroless Plating Fe-Based Alloys
5.1 Why Electroless Plating Fe–B Alloys? 291
5.2 Discovery of EP Fe–B Alloys 292
5.2.1 The Plating Bath and Affective Parameters 294
5.2.2 Analysis of the Diffi culty in Obtaining EP Fe–B Alloys 295
5.2.3 Composition, Structure, and Properties of EP Fe–B Alloys 296
5.2.4 Formation Mechanism of EP Fe–B Alloys 303
5.2.5 Problems and Worthwhile Improvements for EP Fe–B Alloys 304
5.3 EP Binary Fe–B Alloys 305
5.4 EP Fe–B-Based Multicomponent Alloys 307
5.4.1 EP Fe–W–B Alloy Deposits 308
5.4.2 EP Fe–Mo–B Alloy Deposits 310
5.4.3 EP Fe–Sn–B Alloy Deposits 312
5.4.4 EP Fe–W–Mo–B Alloy Deposits 313
5.4.5 EP Fe–Ni–B Alloy Deposits 315
5.5 EP Fe–P Alloys 315
5.6 EP Fe–P-Based Ternary-Component Alloys 317
5.7 Summary 319
References 319
6. Impact Parameters and Deposition Rate
6.1 Effects of Plating Bath Components on Deposition Rate 324
6.1.1 Effect of Metal Salts 324
6.1.2 Effect of Reducing Agent 334
6.1.3 The Effect of Complexing Agent 337
6.1.4 Effect of Stabilizer 342
6.1.5 Effect of Accelerating Agent 349
6.1.6 The Effect of Surfactants 352
6.2 Effects of Operating Conditions 357
6.2.1 Effect of pH Value 357
6.2.2 Effect of Plating T
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