材料科学与工程基础（第5版）（英文影印版）

图书标准信息

• 作者 [美]凯里斯特 著
• 出版社 化学工业出版社
• 出版时间 2004-01
• 版次 1
• ISBN 9787502541781
• 定价 58.00元
• 装帧 平装
• 开本 16开
• 纸张 胶版纸
• 页数 412页

【内容简介】

　　该书具有很完整的材料与工程体系，无论作为材料专业的教材，还是科技书，都具有很强的实用价值。

【目录】

1.Introduction
1.1HistoricalPerspective
1.2MaterialsScienceandEngineering
1.3WhyStudyMaterialsScienceandEngineering?
1.4ClassificationofMaterials
1.5AdvancedMaterials
1.6ModernMaterials’Needs
2.AtomicStructureandInteratomicBonding
2.1Introduction
2.2FundamentalConcepts
2.3ElectronsinAtoms
2.4ThePeriodicTable
2.5BondingForcesandEnergies
2.6PrimaryInteratomicBonds
2.7SecondaryBondingorVanderWaalsBonding
2.8Molecules
3.StructuresofMetalsandCeramics
3.1Introduction
3.2Fundamental
3.3UnitCells
3.4MetallicCrystalStructures
3.5DensityComputations-Metals
3.6CeramicCrystalStructures
3.7DensityComputations-Ceramics
3.8SilicateCeramics
3.9Carbon
3.10PolymorphismandAllotropy
3.11CrystalSystems
3.12CrystallographicDirections
3.13CrystallographicPlanes
3.14LinearandPlanarAtomicDensities
3.15Close-PackedCrystalStructures
3.16SingleCrystals
3.17PolycrystallineMaterials
3.18Anisotropy
3.19X-RayDiffraction：DeterminationofCrystalStructures(CD-ROM)S-6
3.20Noncrystallinesolids
4.PolymerStrutures
4.1Introduction
4.2HydrocarbonMolecules
4.3PolymerMolecules
4.4TheChemistryofPolymerMolecules
4.5MolecularWeight
4.6MolecularShape
4.7MolecularStructure
4.8MolecularConfigurations(CD-ROM)S-11
4.9ThermoplasticandThermosettingPolymers
4.10Copolymers
4.11PolymerCrystals
4.12PolymerCrystals
5.ImperfectionsinSolids
5.1Introduction
5.2PointDefectsinMetals
5.3PointDefectsinCeramics
5.4ImpuritiesinSolids
5.5PointDefectsinPolymers
5.6SpecificationofComposition
5.7Dislocations-LinearDefects
5.8InterfacialDefects
5.9BulkorVolumeDefects
5.10AtomicVibrations
5.11General
5.12MicroscopicTechniques
5.13GrainSizeDetermination
6.Diffusion
6.1Introduction
6.2DiffusionMechanisms
6.3Steady-StateDiffusion
6.4Nonsteady-StateDiffusion
6.5FactorsThatInfluenceDiffusion
6.6OtherDiffusionPaths
6.7DiffusioninIonicandPolymericMaterials
7.MechanicalProperties
7.1Introduction
7.2ConceptsofStressandStrain
7.3Stress-StrainBehavior
7.4Anelasticity
7.5ElasticPropertiesofMaterials
7.6TensileProperties
7.7TrueStressandStrain
7.8ElasticRecoveryDuringPlasticDeformation
7.9Compressive，Shear，andTorsionalDeformation
7.10FlexuralStrength
7.11ElasticBehavior
7.12InfluenceofPorosityontheMechanicalPropertiseofCeramics(CD-ROM)S-22
7.13Stress-StrainBehavior
7.14MacroscopicDeformation
7.15Viscoelasticity(CD-ROM)S-22
7.16Hardness
7.17HardnessofCeramicMaterials
7.18TearStrengthandHardnessofPolymers
7.19VariabilityofMaterialProperties
7.20Design/SafetyFactors
8.DeformationandStrengtheningMechanisms
8.1Introduction
8.2Historical
8.3BasicConceptsofDislocations
8.4CharacteristicsofDislocations
8.5SlipSystems
8.6SlipinSingleCrystals(CD-ROM)S-31
8.7PlasticDeformationofPolycrystallineMetals
8.8DeformationbyTwinning(CD-ROM)S-34
8.9StrengtheningbyGrainSizeReduction
8.10Solid-SolutionStrengthening
8.12Recovery
8.13Recrystallization
8.14GrainGrowth
8.15CrystallineCeramics
8.16NoncrystallineCeramics
8.17DeformationofSemicrystallinePolymers
8.18FactorsThatInfluencetheMechanicalPropertiesofSemicrystallinePolymers[DetailedVersion(CD-ROM)]S-35
8.19DeformationofElastomers
9.Failure
9.1Introduction
9.2FundamentalsofFracture
9.3DuctileFracture
9.4BrittleFracture
9.5aPrinciplesofFractureMechanics[DetailedVersion(CD-ROM)S-38
9.6BrittleFractureofCeramics
9.7FractureofPolymers
9.8ImpactFractureTesting
9.9CyclicStresses
9.10TheS-NCurve
9.11FatigueinPolymericMaterials
9.12aCrackInitiationandPropagation[DetailedVersion(CD-ROM)]S-54
9.13CrackPropagationRate
9.14FactorsThatAffectFatigueLife
9.15EnvironmentalEffects(CD-ROM)S-62
9.16GeneralizedCreepBehavior
9.17bStressandTemperatureEffects(ConciseVersion)S-65
9.18DataExtrapolationMethods
9.19AlloysforHigh-TemperatureUse
9.20CreepinCeramicandPolymericMaterials
10PhaseDiagrams
10.1Introduction
10.2Solubility
10.3Phases
10.4Microstructure
10.5PhaseEquilibria
10.6BinaryIsomorphousSystems
10.7InterpretationofPhaseDiagrams
10.8DevelopmentofMicrostructureinIsomorphousAlloys(CD-ROM)S-67
10.9MechanicalPropertiesofIsomorphousAlloys
10.10BinaryEutecticSystems
10.11DevelopmentofMicrostructureinEutecticAlloys(CD-ROM)S-70
10.12EquilibriumDiagramsHavingIntermediatePhasesorCompounds
10.13EutectoidandPeritecticReactions
10.14CongruentPhaseTransformations
10.15CeramicPhaseDiagrams(CD-ROM)S-77
10.16TernaryPhaseDiagrams
10.17TheGibbsPhaseRule(CD-ROM)S-81
10.18TheIron-IronCarbide(Fe-fe3C)PhaseDiagram
10.19DevelopmentofMicrostructuresinIron-CarbonAlloys
10.20TheInfluenceofOtherAlloyingElements(CD-ROM)S-83
11PhaseTransformations
11.1Introduction
11.2BasicConcepts
11.3TheKineticsofSolid-State
11.4MultiphaseTransformations
11.5IsothermalTransformation
11.6ContinuousCoolingTransformationDiagrams(CD-ROM)S-85
11.7MechanicalBehaviorofIron-CarbonAlloys
11.8TemperedMartensite
11.9ReviewofPhaseTransformationsforIron-CarbonAlloys
11.10HeatTreatments
11.11MechanismofHardening
11.12MiscellaneousConsideratins
11.13Crystallization
11.14Meiting
11.15TheGlassTransition
11.16MeltingandGlassTransitionTemperatures
11.17FactorsThatInfluenceMeltiongandGlassTransitionTemperatures(CD-ROM)S-87
12.ElectricalProperties
12.1Introduction
12.2Ohm’sLaw
12.3ElectricalConductivity
12.4ElectronicandIonicConduction
12.5EnergyBandStructuresinSolids
12.6ConductioninTermsofBandandAtomicBondingModels
12.7ElectronMobility
12.8ElectricalResistivityofMetals
12.9ElectricalCharacteristicsofCommercialAlloys
12.10IntrinsicSemiconduction
12.11ExtrinsicSemiconduction
12.15ConductioninIonicMaterials
12.16ElectricalPropertiesofPolymers
14.Synthesis，Fabrication，andProcessingofMaterials(CD-ROM)S-118
14.1IntroductionS-119
14.2FormingOperationsS-119
14.3Casting
14.4MiscellaneousTechniques
14.5AnnealingProcesses
14.6HeatTreatmentofSteels
14.7FabricationandProcessingofGlasses
14.8FabricationofClayProducts
14.9PowedrPressing
14.10TapeCasting
14.11Polymerizatin
14.12PolymerAdditives
14.13FormingTechniquesforPlastics
14.14FabricationofElastomers
14.15FabricatinofFibersandFilms
15.Composites(CD-ROM)S-162
15.1Introduction
15.2Large-ParticleComposites
15.3Dispersion-StrengthenedComposites
15.4InfluenceofFiberLength
15.5InfluenceofFiberOrientationandConcentration
15.6TheMatrixPhase
15.7TheMatrixPhase
15.8Polymer-MatrixComposites
15.9Metal-MatrixComposites
15.10Ceramic-MatrixComposites
15.11Carbon-CarbonComposites
15.12HybridComposites
15.13ProcessingofFiber-ReinforcedComposites
15.14LaminarComposites
15.15SandwichPanels
16.CorrosionandDegradationofMaterials(CD-ROM)
16.1Introduction
16.2ElectrochemicalConsiderations
16.3CorrosionRates
16.4PredictionofCorrosionRates
16.5Passivity
16.6EnvironmentalEffects
16.7FormsofCorrosion
16.8CorrosionEnvironments
16.9CorrosionPrevention
16.10Oxidaton
16.11SwellingandDissolution
16.12BondRupture
16.13Weathering
17.ThermalProperties(CD-ROM)
17.1Introduction
17.2HeatCapacity
17.3ThermalExpansion
17.4ThermalConductivity
17.5ThermalStresses
18.MagneticProperties
18.1Introduction
18.2BasicConcepts
18.3DiamagnetismandParamagnetism
18.4Ferromagnetism
18.5AntiferromagnetismandFerrimagnetism
18.6TheInfluenceofTemperatureonMagneticBehavior
18.7DomainsandHysteresis
18.8SoftMagneticMaterials
18.9HardMagneticMaterials
18.10MagneticStorage
18.11Superconductivity
19.OpticalProperties(CD-ROM)
19.1Introduction
19.2ElectromagneticRadiation
19.3LightInteractionswithSolids
19.4AtomicandElectronicInteractions
19.5Refraction
19.6Reflection
19.7Absorption
19.8Transmission
19.9Color
19.10OpacityandTranslucencyinInsulators
19.11Luminescence
19.12Photoconductivity
19.13Lasers
19.14OpticalFibersinCommunications
20.MaterialsSelectionandDesignConsiderations(CD-ROM)
20.1Introduction
20.2Strength
20.3OtherPropertyConsiderationsandtheFinalDecision
20.4Introduction
20.5AutomobileValveSpring
20.6AnatomyoftheHipJoint
20.7MaterialRequirements
20.8MaterialsEmployed
20.9Introduction
20.10ThermalProtectionSystem-DesignRequirements
20.11ThermalProtectionSystem-Components
20.12Introduction
20.13LeadframeDesignandMaterials
20.14DisBonding
20.15WireBonding
20.16PackageEncapsulation
20.17TapeAutomatedBonding
21.Economic，Enironmental，andSocietalIssuesinMaterialsScienceandEngineering
21.1Introduction
21.2ComponentDesign
21.3Materials
21.4ManufacturingTechniques
21.5RecyclingIssuesinMaterialsScienceandEngineering