Polymeric Materials for Electronic Packaging，电子封装用高分子材料，英文原版
￥ 1390 九五品
仅1件
作者Shozo Nakamura
出版社Wiley-IEEE Press
ISBN9781394188796
出版时间2023-08
装帧精装
纸张其他
页数208页
正文语种英文
上书时间2024-04-30
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