• 智能制造数字化增材制造
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智能制造数字化增材制造

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12.25 2.5折 49 八五品

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作者郑维明 李志 仰磊 程泽阳 陈虎

出版社机械工业出版社

出版时间2021-03

版次1

装帧其他

货号9787111674757

上书时间2024-08-27

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图书标准信息
  • 作者 郑维明 李志 仰磊 程泽阳 陈虎
  • 出版社 机械工业出版社
  • 出版时间 2021-03
  • 版次 1
  • ISBN 9787111674757
  • 定价 49.00元
  • 装帧 其他
  • 开本 16开
  • 纸张 胶版纸
  • 页数 216页
  • 字数 319千字
【内容简介】
本书作为智能制造类产教融合人才培养系列教材之一,以西门子工业
  软件相关技术平台为支撑。针对增材制造( 3D打印)技术的应用,西门
  子工业软件提供了从需求驱动的创成式设计到 3D打印的端到端集成的增
  材制造解决方案,涵盖了面向增材制造的创新设计、仿真分析、打印准备
  以及生产运营,着力于实现增材制造的工业化应用。
  本书以机械、汽车、模具、航空等行业应用为背景,结合面向增材制
  造的设计、仿真和生产的行业需求,在产品设计、预测性工程分析、 3D
  打印准备等方面介绍了数字化增材制造过程链,具体包括:面向增材制造
  应用的三维设计和验证,先进的晶格结构设计方法,基于逆向工程的三维
  打印,创成式设计及拓扑优化,增材制造前处理,多轴增材制造,过程仿
  真和后处理,以及典型行业中的零件打印实例。
  本书针对具体案例,先介绍其设计原理和方法,然后以西门子工业软
  件的增材制造环境为基础,介绍操作过程,做到理论与实践相结合;同时
  运用了“互联网 +”形式,在重要知识点嵌入二维码,方便读者理解相关
  知识,进行更深入的学习。读者可通过逐步学习每个章节,掌握面向增材
  制造的先进设计理念,并通过案例实践掌握所学内容。
  本书可以作为高等职业院校和职业本科院校机械、模具、汽车类相关专业的教材,也可供从事产品设计和制造的技术人员使用。为便于教学,本书配套有电子课件、操作视频、案例模型等教学资源,凡选用本书作为授课教材的教师可登录机械工业出版社教育服务网(http://www.cmpedu.com)注册后免费下载。
【目录】
前言

二维码索引

第 1章增材制造技术概论 ·····························································001

第 2章增材制造技术架构 ·····························································004 

2.1

 典型工艺 ·········································································004 

2.2

 关键设计方法···································································006 

2.3

 全价值链软件集成·····························································008 

2.4

 增材制造构型···································································009 

2.5

 面向增材制造的零件设计 ····················································010

第 3章增材制造的设计验证 ··························································013 

3.1

 打印空间 ·········································································013 

3.2

 延展角度 ·········································································019 

3.3

 壁厚 ···············································································022 

3.4

 最小半径 ·········································································024 

3.5

 完全封闭空间体································································028 

3.6

 通道比率 ·········································································030 

3.7

 牢靠支撑 ·········································································036 

3.8

 打印时间 ·········································································038 

3.9

 过热分析 ·········································································042 

3.10

 优化部件方位 ·································································043

第 4章晶格构型 ·········································································052 

4.1

 晶格构型介绍···································································052 

4.2

 晶格构型方法···································································053 

4.3

 晶格构型体积定义·····························································064 

4.4

 产生晶格体······································································065 

4.5

 连接晶格体······································································066 

4.6

 清理晶格体······································································067 

4.7

 自定义晶格
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