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SMT单板互连可靠性与典型失效场景

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广东广州

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作者贾忠中著

出版社电子工业出版社

ISBN9787121486371

出版时间2024-08

装帧平装

开本其他

定价168元

货号1203378767

上书时间2024-10-03

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品相描述：全新

商品描述: 目录
第一部分焊点失效机理与裂纹特征
第 1 章焊点的可靠性 ............................................................................................ 3
1.1 焊点 ...........................................................................................................................................3
1.1.1 焊点的微观组织结构及常见失效位置 ........................................................................4
1.1.2 焊点的失效标准 ............................................................................................................4
1.1.3 焊点的断裂类型 ............................................................................................................5
1.2 导致焊点失效的载荷条件 .......................................................................................................7
1.3 焊点失效机理 ...........................................................................................................................7
1.3.1 温度循环引发的焊点失效机理 ....................................................................................7
1.3.2 机械应力引发的焊点失效机理 ..................................................................................10
1.3.3 热冲击引发的焊点失效机理 ......................................................................................12
1.3.4 蠕变引发的焊点失效机理 ..........................................................................................13
1.4 焊点的可靠性评价 .................................................................................................................14
1.4.1 焊点的可靠性取决于 PCBA 的互连结构设计 ..........................................................14
1.4.2 焊点的可靠性工作 ......................................................................................................14
1.4.3 焊点失效原因分析流程 ..............................................................................................15
案例 1：某单板上的 BGA 使用两年后失效 .............................................................15
第 2 章温度循环导致的焊点失效........................................................................... 17
2.1 疲劳失效的典型场景 .............................................................................................................17
2.1.1 整体热膨胀失配 ..........................................................................................................17
2.1.2 局部热膨胀失配 ..........................................................................................................18
2.1.3 内部热膨胀失配 ..........................................................................................................18
2.2 疲劳失效的裂纹演进过程与特征 .........................................................................................18
2.2.1 片式元件焊点疲劳失效典型裂纹特征 ......................................................................19
2.2.2 翼形引脚焊点疲劳失效典型裂纹特征 ......................................................................19
2.2.3 BGA 焊点疲劳失效典型裂纹特征 .............................................................................20
SMT 单板互连可靠性与典型失效场景
2.2.4 QFN 焊点疲劳失效典型裂纹特征 .............................................................................21
2.2.5 CBGA 焊点疲劳失效典型裂纹特征 ..........................................................................22
2.2.6 CCGA 焊点疲劳失效典型裂纹特征 ..........................................................................23
2.2.7 通孔插装焊点疲劳失效典型裂纹特征 ......................................................................24
2.2.8 焊接工艺对裂纹特征的影响 ......................................................................................24
2.3 小结 .........................................................................................................................................25
第 3 章机械应力导致的焊点失效........................................................................... 27
3.1 机械应力失效的典型场景 .....................................................................................................27
3.1.1 冲击 ..............................................................................................................................27
案例 2：BGA 脱落 ......................................................................................................27
3.1.2 瞬时弯曲 ......................................................................................................................29
案例 3：插件操作导致 BGA 焊点开裂 .....................................................................29
3.1.3 循环弯曲 ......................................................................................................................31
3.1.4 振动 ..............................................................................................................................31
3.2 机械应力失效的裂纹特征 .....................................................................................................31
3.3 脆性的界面 IMC ....................................................................................................................33
3.3.1 ENIG 镀层形成的焊点具有脆性 ................................................................................34
案例 4：Ni 氧化导致焊点界面脆化 ...........................................................................37
3.3.2 不连续的块状 IMC ......................................................................................................40
3.4 典型应力敏感元件及应力失效 .............................................................................................41
3.4.1 应力敏感封装 ..............................................................................................................41
3.4.2 片式电容 .....................................................................................................................41
3.4.3 球栅阵列封装 ..............................................................................................................46
案例 5：ICT 测试导致 BGA 焊点开裂 ......................................................................46
案例 6：压接导致 BGA 焊点开裂 .............................................................................48
第 4 章焊点失效分析方法.................................................................................... 51
4.1 失效分析及方法 .....................................................................................................................51
4.1.1 失效分析 ......................................................................................................................51
4.1.2 失效分析思路 ..............................................................................................................51
4.1.3 失效分析基本流程与方法 ..........................................................................................51
4.1.4 焊点失效分析的常用方法 ..........................................................................................52
4.2 X 射线检测 .............................................................................................................................53
4.2.1 X 射线图像的采集原理...............................................................................................54
4.2.2 X 射线图像的分析.......................................................................................................56
4.3 超声扫描显微镜 .....................................................................................................................58
4.3.1 超声扫描显微镜概述 ..................................................................................................58
4.3.2 超声扫描显微镜的工作原理 ......................................................................................58
4.3.3 分析步骤 ......................................................................................................................60
4.3.4 超声扫描显微镜和 X 射线的对比..............................................................................61
4.4 切片 .........................................................................................................................................62
4.4.1 切片样品的制备 ..........................................................................................................62
4.4.2 切片分析应用 ..............................................................................................................64
4.5 扫描电子显微镜 .....................................................................................................................65
4.5.1 扫描电子显微镜概述 ..................................................................................................65
4.5.2 扫描电子显微镜的工作原理 ......................................................................................66
4.5.3 SEM 的优点 .................................................................................................................66
4.5.4 样品的制备 ..................................................................................................................66
4.5.5 应用 ..............................................................................................................................67
4.6 染色渗透 .................................................................................................................................69
4.7 光学检测 .................................................................................................................................70
4.8 傅里叶变换红外光谱仪 .........................................................................................................71
案例 7：PCBA 白色污染物成分的分析 ....................................................................71
案例 8：材料一致性检验 ............................................................................................72
第 5 章失效原因的基本判定................................................................................. 73
5.1 焊接问题与组装问题的判定 .................................................................................................73
5.1.1 焊接合格的标准 ..........................................................................................................73
5.1.2 组装应力引诱或导致的焊点失效 ..............................................................................75
5.2 焊点开裂裂纹特征图谱 .........................................................................................................77
5.2.1 典型热 / 机疲劳断裂焊点切片图 ...............................................................................77
5.2.2 典型机械应力导致的焊点断裂切片图 .........................

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SMT单板互连可靠性与典型失效场景

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