伪集成电路检测与防护
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作者(美)马克(穆罕默德)·德黑兰尼普尔 等
出版社国防工业出版社
ISBN9787118125009
出版时间2022-07
装帧精装
开本16开
定价125元
货号1202701327
上书时间2024-05-30
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目录
引言--------------------------------------------------------------------------------------------------- 1伪造发展史------------------------------------------------------------------------------------ 2伪造产品--------------------------------------------------------------------------------------- 3伪造：超过万亿美元的市场---------------------------------------------------------------- 4伪电子：新兴威胁---------------------------------------------------------------------------- 5基于国防工业的评估：伪电子--------------------------------------------------- 91.5 小结--------------------------------------------------------------------------------------------- 12参考文献---------------------------------------------------------------------------------------------- 14伪集成电路------------------------------------------------------------------------------------------- 15伪IC的形式------------------------------------------------------------------------------------ 17伪IC的分类------------------------------------------------------------------------------------ 18回收型--------------------------------------------------------------------------------- 19重标识型--------------------------------------------------------------------------------21过量生产型---------------------------------------------------------------------------- 22未达标缺陷型------------------------------------------------------------------------ 23克隆型--------------------------------------------------------------------------------- 25伪造文档型--------------------------------------------------------------------------- 25篡改型--------------------------------------------------------------------------------- 26供应链脆弱性---------------------------------------------------------------------------------- 27设计------------------------------------------------------------------------------------ 27生产------------------------------------------------------------------------------------ 28组装------------------------------------------------------------------------------------ 28分销------------------------------------------------------------------------------------ 28系统集成生命周期----------------------------------------------------------------- 29报废------------------------------------------------------------------------------------ 29伪IC的检测与预防-------------------------------------------------------------------------- 29检测现状----------------------------------------------------------------------------- 30预防现状----------------------------------------------------------------------------- 32小结---------------------------------------------------------------------------------------------- 33参考文献---------------------------------------------------------------------------------------------- 34伪造所产生的缺陷--------------------------------------------------------------------------------- 37伪造缺陷的分类------------------------------------------------------------------------------- 38程序缺陷---------------------------------------------------------------------------------------- 38物理缺陷---------------------------------------------------------------------------------------- 43引线、焊球和铜柱----------------------------------------------------------------- 44封装----------------------------------------------------------------------------------- 50键合线-------------------------------------------------------------------------------- 56裸片----------------------------------------------------------------------------------- 59环境缺陷---------------------------------------------------------------------------------------- 63电子缺陷--------------------------------------------------------------------------------------- 65参数缺陷---------------------------------------------------------------------------- 66制造缺陷---------------------------------------------------------------------------- 69小结-------------------------------------------------------------------------------------------- 71参考文献--------------------------------------------------------------------------------------------- 72基于物理测试的伪IC检测 -------------------------------------------------------------------- 75伪IC检测方法的分类 ------------------------------------------------------------------- 76物理检查--------------------------------------------------------------------------------------- 784.2.1 外部视觉检查 (EVI) ------------------------------------------------------------- 784.2.2 X射线成像 ------------------------------------------------------------------------- 814.2.3 Delid打开封装---------------------------------------------------------------------- 834.2.4 声学扫描显微镜 (SAM) ---------------------------------------------------------- 834.2.5 电子扫描显微镜 (SEM) ---------------------------------------------------------- 854.2.6 X射线荧光（XRF）光谱分析 ------------------------------------------------- 874.2.7 傅立叶变换红外（FTIR）光谱分析--------------------------------------------- 874.2.8 能量色散光谱 (EDS) 分析------------------------------------------------------ 874.2.9 温度周期 ---------------------------------------------------------------------------- 884.2.10 密封测试------------------------------------------------------------------------------ 904.3 局限和挑战 ------------------------------------------------------------------------------904.4 小结 ---------------------------------------------------------------------------------------91参考文献------------------------------------------------------------------------------------------------92基于电子测试的伪IC检测-------------------------------------------------------------------------955.1 检测设备 --------------------------------------------------------------------------------------965.1.1 测试基准设备 -----------------------------------------------------------------------965.1.2 自动测试设备 (ATE) ----------------------------------------------------------------975.2 变化曲线跟踪 ---------------------------------------------------------------------------------975.3 关键电参数测试 ------------------------------------------------------------------------------995.4 老化测试 --------------------------------------------------------------------------------------1035.5 局限和挑战 ----------------------------------------------------------------------------------1035.6 小结 --------------------------------------------------------------------------------------------105参考文献 --------------------------------------------------------------------------------------------- 106伪IC测试覆盖率：对当前伪IC检测方法的评估 ------------------------------------------1096.1 测试实验室的能力和专业知识的差异 -------------------------------------------------1106.2 术语 --------------------------------------------------------------------------------------------1116.2.1 层级 -----------------------------------------------------------------------------------1116.2.2 目标置信度 -------------------------------------------------------------------------1126.2.3 测试方法 ----------------------------------------------------------------------------1126.2.4 伪IC缺陷 ---------------------------------------------------------------------------1126.2.5 置信度矩阵---------------------------------------------------------------------------1126.2.6 缺陷频率------------------------------------------------------------------------------1136.2.7 决策指数------------------------------------------------------------------------------1136.2.8 缺陷映射矩阵 ---------------------------------------------------------------------1136.2.9 输入采集相关的挑战 ------------------------------------------------------------1156.3 测试指标----------------------------------------------------------------------------------------1156.3.1 伪IC缺陷覆盖率 (CDC) ---------------------------------------------------------1156.3.2 伪IC类型覆盖率 (CTC) ---------------------------------------------------------1166.3.3 未覆盖缺陷 (NCDs) ---------------------------------------------------------------1176.3.4 已覆盖缺陷 (UCDs) ---------------------------------------------------------------1176.4 评估框架 ------------------------------------------------------------------------------------1176.4.1 静态评估------------------------------------------------------------------------------1186.4.2 动态评估 ----------------------------------------------------------------------------1226.4.3 静态评估和动态评估的对比----------------------------------------------------1266.5 小结---------------------------------------------------------------------------------------------130参考文献 ---------------------------------------------------------------------------------------------130高级检测：物理测试 -----------------------------------------------------------------------------1337.1 二维特征的局限性 -----------------------------------------------------------------------1347.2 四维扫描电子显微镜 -------------------------------------------------------------------1377.2.1 采集阶段 ----------------------------------------------------------------------------1387.2.2 深度提取阶段 ----------------------------------------------------------------------1427.3 3D表面的量化：不当纹理变化 -------------------------------------------------------1457.4 3D X射线显微镜 --------------------------------------------------------------------------1477.5 测试结果总结 -------------------------------------------------------------------------------1517.6 小结---------------------------------------------------------------------------------------------152参考文献-----------------------------------------------------------------------------------------------153高级检测：电子测试 ------------------------------------------------------------------------------1578.1 回收FPGA的二相检测法-----------------------------------------------------------------1588.1.1 老化和回收的 FPGA --------------------------------------------------------------1588.1.2 回收FPGA的二相检测方法 ----------------------------------------------------1618.2 路径延迟分析--------------------------------------------------------------------------------1678.2.1 老化对路径延迟的影响 -----------------------------------------------------------1688.2.2 路径延迟指纹 ----------------------------------------------------------------------1688.2.3 时钟扫描 ---------------------------------------------------------------------------1708.2.4 数据分析 ----------------------------------------------------------------------------1718.2.5 结果 --------------------------------------------------
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