智能制造数字化增材制造

增材制造（Additive Manufacturing，AM）也称 3D打印，是相对于传统切削方式的
减材制造和利用模具的等材制造，以材料累积为基本特征，通过不同的能量源与 CAD/ 
CAM技术相结合的制造方式。它正在推动创新并帮助企业克服生产障碍，通过减材、减
重，扩展产品性能等方法来重塑产品，将产品变革从传统设计往面向增材制造的创新设计
方面转移；通过消除开模、消除或简化装配等重组制造，将增材制造从原型应用 /试验应
用往主流工业化生产方面转移，从而实现个性化、定制化、按需打印等，帮助企业重构
业务。
但是，当企业试图采用增材制造这一新技术的时候，也面临一些限制。目前的实际情
况是企业采用独立的应用系统，而它们常常不能一起工作或需要通过文件交换来协同，从
而导致数据和流程管理的失控，因而企业需要消除这些障碍，将增材制造融入产品研发制
造的实际过程，实现增材制造的工业化应用。
西门子股份公司不仅是工业 4.0的倡导者，更是工业领域实践的排头兵，它提供了数
字化企业所必需的多学科专业领域*广泛的工业软件和行业知识，涵盖了机械设计、电子
及自动化设计、软件工程、仿真测试、制造规划、制造运行等方面，可以帮助学校建立同
时满足科研、实训与企业服务的产教融合平台。
为了满足企业对数字化增材制造的能力需求与人才需求，本书提供了从需求驱动的
创成式设计到 3D打印的端到端集成的增材制造解决方案，涵盖了面向增材制造的创新设计、仿真分析、打印准备以及生产运营，着力于实现增材制造的工业化应用。同时运用了 “互联网 ”技术，在部分知识点附近设置了二维码，使用者可以用智能手机进行扫描，便可在手机屏幕上显示和教学内容相关的多媒体内容，方便读者理解相关知识，进行更深
入的学习。

前言
二维码索引

第 1章增材制造技术概论 ·····························································001
第 2章增材制造技术架构 ·····························································004 
2.1
　典型工艺 ·········································································004 

2.2
　关键设计方法···································································006 

2.3
　全价值链软件集成·····························································008 

2.4
　增材制造构型···································································009 

2.5
　面向增材制造的零件设计 ····················································010

第 3章增材制造的设计验证 ··························································013 
3.1
　打印空间 ·········································································013 

3.2
　延展角度 ·········································································019 

3.3
　壁厚 ···············································································022 

3.4
　*小半径 ·········································································024 

3.5
　完全封闭空间体································································028 

3.6
　通道比率 ·········································································030 

3.7
　牢靠支撑 ·········································································036 

3.8
　打印时间 ·········································································038 

3.9
　过热分析 ·········································································042 

3.10
　优化部件方位 ·································································043

第 4章晶格构型 ·········································································052 
4.1
　晶格构型介绍···································································052 

4.2
　晶格构型方法···································································053 

4.3
　晶格构型体积定义·····························································064 

4.4
　产生晶格体······································································065 

4.5
　连接晶格体······································································066 

4.6
　清理晶格体······································································067 

4.7
　自定义晶格