光电集成电路设计与器件建模
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作者高建军 著
出版社高等教育出版社
ISBN9787040313260
出版时间2011-01
版次1
装帧平装
开本16开
纸张胶版纸
页数292页
字数99999千字
定价59元
上书时间2024-05-25
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基本信息
书名:光电集成电路设计与器件建模
定价：59元
作者:高建军 著
出版社：高等教育出版社
出版日期：2011-01-01
ISBN：9787040313260
字数：350000
页码：292
版次：1
装帧：平装
开本：16开
商品重量：
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内容提要
高建军编著的《光电集成电路设计与器件建模》主要介绍微波技术在光电子集成电路设计领域的应用，内容涵盖先进的半导体光电子器件建模技术、高速光发射和接收电路设计技术，器件涉及半导体激光器、半导体探测器以及多种高速半导体器件，特别是对于双极晶体管和场效应晶体管在超高速光电子集成电路中的应用进行了详细的讨论。 《光电集成电路设计与器件建模》在微波器件建模技术和光电子集成电路设计之间架起了一座学科贯通的桥梁，非常适合微波射频领域和光电子领域的高年级本科生、研究生和科研工作人员入门学习。
目录
PrefaceAbout the Author1 Nomenclature Introductio 1.1 Optical Communication System 1.2 Optoelectronic Integrated Circuit Computer-Aided Desig 1.3 Organization of This Book References2 Basic Concept of Semiconductor Laser Diodes 2.1 Introductio 2.2 Basic Concept 2.2.1 Atom Energy 2.2.2 Emission and Absorptio 2.2.3 Population Inversio 2.3 Structures and Types 2.3.1 Homojunction and Heterojunctio 2.3.2 Index Guiding and Gain Guiding 2.3.3 Fabry-Perot Cavity Lasers 2.3.4 Quantum-Well Lasers 2.3.5 Distributed Feedback Lasers 2.3.6 Vertical-Cavity Surface-Emitting Lasers 2.4 Laser Characteristics 2.4.1 Single-Mode Rate Equations 2.4.2 Multimode Rate Equations 2.4.3 Small-Signal Intensity Modulatio 2.4.4 Small-Signal Frequency Modulatio 2.4.5 Large-Signal Transit Response 2.4.6 Second Harmonic Distortio 2.4.7 Relative Intensity Noise 2.4.8 Measurement Technique 2.5 Summary References3 Modeling and Parameter Extraction Techniques of Lasers 3.1 Introductio 3.2 Standard Double Heterojunction Semiconductor Lasers 3.2.1 Large-Signal Model 3.2.2 Small-Signal Model 3.2.3 Noise Model 3.3 Quantum-Well Lasers 3.3.1 One-Level Equivalent Circuit Model 3.3.2 Two-Level Equivalent Circuit Model 3.3.3 Three-Level Equivalent Circuit Model 3.4 Parameter Extraction Methods 3.4.1 Direct-Extraction Method 3.4.2 Semi-Analytical Method 3.5 Summary References4 Microwave Modeling Techniques of Photodiodes 4.1 Introductio 4.2 Physical Principles 4.3 Figures of Merit 4.3.1 Responsivity 4.3.2 Quantum Efficiency 4.3.3 Absorption Coefficient 4.3.4 Dark Current 4.3.5 Rise Time and Bandwidth 4.3.6 Noise Currents 4.4 Microwave Modeling Techniques 4.4.1 PIN PD 4.4.2 APD 4.5 Summary References5 High-Speed Electronic Semiconductor Devices 5.1 Overview of Microwave Transistors 5.2 FET Modeling Technique 5.2.1 FET Small-Signal Modeling 5.2.2 FET Large-Signal Modeling 5.2.3 FET Noise Modeling 5.3 GaAs/InP HBT Modeling Technique 5.3.1 GaAs/InP HBT Nonlinear Model 5.3.2 GaAs/InP HBT Linear Model 5.3.3 GaAs/InP HBT Noise Model 5.3.4 Parameter Extraction Methods 5.4 SiGe HBT Modeling Technique 5.5 MOSFET Modeling Technique 5.5.1 MOSFET Small-Signal Model 5.5.2 MOSFET Noise Model 5.5.3 Parameter Extraction Methods 5.6 Summary References6 Semiconductor Laser and Modulator Driver Circuit Desig 6.1 Basic Concepts 6.1.1 NRZ and RZ Data 6.1.2 Optical Modulatio 6.1.3 Optical External Modulator 6.2 Optoelectronic Integration Technology 6.2.1 Monofithic Optoelectronic Integrated Circuits 6.2.2 Hybrid Optoelectronic Integrated Circuits 6.3 Laser Driver Circuit Desig 6.4 Modulator Driver Circuit Desig 6.4.1 FET-Based Driver Circuit 6.4.2 Bipolar Transistor-Based Driver Integrated Circuit 6.4.3 MOSFET-Based Driver Integrated Circuit 6.5 Distributed Driver Circuit Desig 6.6 Passive Peaking Techniques 6.6.1 Capacitive Peaking Techniques 6.6.2 Inductive Peaking Techniques 6.7 Summary References7 Optical Receiver Front-End, Integrated Circuit Desig 7.1 Basic Concepts of the Optical Receiver 7.1.1 Signal-to-Noise Ratio 7.1.2 Bit Error Ratio 7.1.3 Sensitivity 7.1.4 Eye Diagram 7.1.5 Signal Bandwidth 7.1.6 Dynamic Range 7.2 Front-End Circuit Desig 7.2.1 Hybrid and Monolithic OEIC 7.2.2 High-Impedance Front-End 7.2.3 Transimpedance Front-End 7.3 Transi-mpedance Gain and Equivalent Input Noise Current 7.3.1 S Parameters of a Two-Port Network 7.3.2 Noise Figure of a Two-Port Network 7.3.3 Transimpedance Gai 7.3.4 Equivalent Input Noise Current 7.3.5 Simulation and Measurement of Transimpedance Gain and Equivalent Input Noise Current 7.4 Transimpedance Amplifier Circuit Desig 7.4.1 BJT-Based Circuit Desig 7.4.2 HBT-Based Circuit Desig 7.4.3 FET-Based Circuit Desig 7.4.4 MOSFET-Based Circuit Desig 7.4.5 Distributed Circuit Desig 7.5 Passive Peaking Techniques 7.5.1 Inductive Peaking Techniques 7.5.2 Capacitive Peaking Techniques 7.6 Matching Techniques 7.7 Summary ReferencesIndex
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