3DIC集成和封装(英文影印版)/电子信息前沿技术丛书
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浙江嘉兴
认证卖家担保交易快速发货售后保障
作者(美)刘汉诚
出版社清华大学出版社
ISBN9787302600657
出版时间2022-04
装帧其他
开本16开
定价129元
货号31427038
上书时间2024-12-16
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目录
Preface
1 3D Integration for Semiconductor IC Packaging
1.1 Introduction
1.2 3D Integration
1.3 3D IC Packaging
1.4 3D Si Integration
1.5 3D IC Integration
1.5.1 Hybrid Memory Cube
1.5.2 Wide I/O DRAM and Wide I/O 2
1.5.3 High Bandwidth Memory
1.5.4 Wide I/O Memory (or Logic-on-Logic)
1.5.5 Passive Interposer (2.5D IC Integration)
1.6 Supply Chains before the TSV Era
1.6.1 FEOL (Front-End-of-Line)
1.6.2 BEOL (Back-End-of-Line)
1.6.3 OSAT (Outsourced Semiconductor Assembly and Test)
1.7 Supply Chains for the TSV Era-Who Makes the TSV
1.7.1 TSVs Fabricated by the Via-First Process
1.7.2 TSVs Fabricated by the Via-Middle Process
1.7.3 TSVs Fabricated by the Via-Last (from the Front Side) Process
1.7.4 TSVs Fabricated by the Via-Last (from the Back Side) Process
1.7.5 How About the Passive TSV Interposers
1.7.6 Who Wants to Fabricate the TSV for Passive Interposers
1.7.7 Summary and Recommendations
1.8 Supply Chains for the TSV Era-Who Does the MEOL, Assembly, and Test
1.8.1 Wide I/O Memory (Face-to-Back) by TSV Via-Middle Fabrication Process
1.8.2 Wide I/O Memory (Face-to-Face) by TSV Via-Middle Fabrication Process
1.8.3 Wide I/O DRAM by TSV Via-Middle Fabrication Process
1.8.4 2.5D IC Integration with TSV/RDL Passive Interposers
1.8.5 Summary and Recommendations
1.9 CMOS Images Sensors with TSVs
1.9.1 Toshiba's DynastronTM
1.9.2 STMicroelectronics' VGA CIS Camera Module
1.9.3 Samsung's S5K4E5YX BSI CIS
1.9.4 Toshiba's HEW4 BSI TCM5103PL
1.9.5 Nemotek's CIS
1.9.6 SONY's ISX014 Stacked Camera Sensor
1.10 MEMS with TSVs
1.10.1 STMicroelectronics’ MEMS Inertial Sensors
1.10.2 Discera's MEME Resonator
1.10.3 Avago's FBAR MEMS Filter
1.11 References
2 Through-Silicon Vias Modeling and Testing
2.1 Introduction
2.2 Electrical Modeling of TSVs
2.2.1 Analytic Model and Equations for a Generic TSV Structure
2.2.2 Verification of the Proposed TSV Model in Frequency Domain
2.2.3 Verification of the Proposed TSV Model in Time Domain
2.2.4 TSV Electrical Design Guideline
2.2.5 Summary and Recommendations
内容摘要
随着集成电路应用多元化，人工智能、物联网、自动驾驶、5G网络、高性能计算等新兴产业对封装技术提出更高要求，先进封装向着集成、三维、高速、高频方向发展。本书全面讲解3D集成技术的近期进展和发展趋势，重点讨论3D集成技术的关键技术、主要工艺问题和可行解决方案。本书适合从事电子、光电子、
MEMS等器件3D集成研究的工程技术人员、技术研发人员和科研人员阅读，也可以作为相关专业高年级本科生
和研究生的教材。
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