《化合物半导体加工中的表征(英文)》的主要内容包括: Preface to the Reissue of the Materials Characterization Series ix;Preface to Series x;Preface to the Reissue of Characterization of CompoundSemiconductor Processing xi;Preface xiii;Contributors xv等。
【目录】
Preface to the Reissue of the Materials Characterization Series ix Preface to Series x Preface to the Reissue of Characterization of Compound Semiconductor Processing xi Preface xiii Contributors xv CHARACTERIZATION OF III—V THIN FILMS FOR ELECTRONIC DEVICES III—V COMPOUND SEMICONDUCTOR FILMS FOR OPTICAL APPLICATIONS CONTACTS DIELECTRIC INSULATING LAYERS OTHER COMPOUND SEMICONDUCTOR FILMS DEEP LEVEL TRANSIENT SPECTROSCOPY: A CASE STUDY ON GaAs APPENDIX: TECHNIQUE SUMMARIES
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